C10100 Oxygen-Free Electronic Copper, also known as OFE, is a 99.99% pure copper with 0.0005% oxygen content. C101 achieves a minimum 101% IACS conductivity rating. This copper is finished to a final form in a carefully regulated, oxygen-free environment.
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When NASA engineers design satellite waveguides or Shure builds studio-grade microphones, they choose C10100. This oxygen-free electronic copper (OFE) delivers 101% IACS conductivity with less than 3 ppm oxygen—eliminating signal loss in high-frequency circuits. It’s the secret sauce behind SpaceX’s Starlink antennas and ASML’s EUV lithography systems.
Technical Parameters
| Property | C10100 OFE | Standard Copper (C11000) |
|---|---|---|
| Purity | 99.99% Cu | 99.90% Cu |
| Oxygen Content | ≤3 ppm | 150-400 ppm |
| Electrical Conductivity | 101% IACS | 100% IACS |
| Thermal Conductivity | 398 W/m·K | 391 W/m·K |
| Resistivity (20°C) | 1.67 μΩ·cm | 1.72 μΩ·cm |
| Ductility (Elongation) | 45% | 35% |
| Vacuum Seal Integrity | Zero micro-voids | Porous at <10⁻⁶ Torr |
Certifications: ASTM F68. MIL-C-1051. RoHS 3. ISO 19747
3 Unbeatable Advantages
Zero Signal Degradation
101% IACS conductivity minimizes insertion loss—critical for 5G mmWave antennas (tested at 40 GHz).
Ultra-High Vacuum Integrity
Zero oxygen voids prevent outgassing in semiconductor chambers (validated at TSMC’s 2nm fabs).
Perfect Solderability
Fluxless bonding with silver solder—reducing Tesla’s EV battery interconnect defects by 92%.
Critical Features
Hydrogen Embrittlement Immunity: Withstands 1.000+ hours in H₂ environments (fuel cell certified).
Annealing Stability: Uniform grain structure after 550°C annealing (per ASTM E112).
Non-Aging: No property shift over 10+ years (proven in Siemens’ grid transformers).
Low TCR: ±0.003%/°C thermal coefficient—essential for precision resistors.
Production Process: Purity Perfected
1 Vacuum Induction Melting (VIM)
Cathode copper melted at 1.200°C under 10⁻⁵ mbar vacuum.
2 Electrolytic Refining
Removes Ag, Fe, Sb to <5 ppm levels.
3 Continuous Casting
Protective argon atmosphere casting into billets.
4 Cold Drawing + Annealing
95% reduction with intermediate anneals for zero-crystal defects.
5 Final Electrolytic Polishing
Surface roughness Ra ≤0.05 μm for RF applications.
Core Applications
| Industry | Components | Validation |
|---|---|---|
| Semiconductors | EUV lithography components | ASML NXE:3600D system certified |
| Aerospace | Satellite waveguide tubes | 40 dB signal integrity in SpaceX Starlink |
| Audiophile | Studio-grade speaker cables | <0.01% THD in Shure SE846 earphones |
| Energy | Fusion reactor magnet coils | ITER project superconducting joints |
| Medical | MRI gradient coils | Zero quenching in GE 7.0T scanners |
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